Siru. Reduced signal inductance – Because the interconnect is much shorter in length (01 mm vs 1–5 mm) the inductance of the signal path is greatly reduced This is a key factor in highspeed communication and switching devices Reduced power/ground inductance – By using flip chip interconnect power can be brought directly into the core of the die rather than requiring.
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Flip Chip Packaging Amkor Technology
白川郷は1995年12月に、「白川郷・五箇山の合掌造り集落」としてユネスコの世界遺産へ登録されることが決まりました。より具体的には、岐阜県白川村荻町（しらかわむらおぎまち）、富山県平村相倉（たいらむらあいのくら）、同県上平村菅沼（かみたいらむらすがぬま）の合掌造り集落が.